Detection of defects in structures with metallic surfaces
In this project, defects in solder connections were identified. Working together with the customer, it was defined which solder connections were permissible and which were not.
Subsequently, a kim s-series system was trained in such a way that exactly these spots were detected. Due to multi-variant image capturing, the system is so reliable that it already correctly evaluated more than 98% of the spots in a feasiblity study with just a few images. This performance convinced the customer to employ the system.
It also shows that kim is able to make confident decisions even on shiny metallic surfaces.